中文
400-888-0829
SAM-US301
Application
IGBT module layered detection.
Semiconductor chip packaging layer detection.
Diamond thickness measurement and internal defect detection.
Detection of welding defect of water-cooled radiator plate.
Features
Multiple scanning modes
Analysis of samples in the ultrasound frequency range up to 1GHz/s
Equipped with a graphical user interface for ease of operation and flexible applicability
Scanning range: 400㎜*320㎜*120㎜
Technical Parameter
Unit size
1100mm×1020mm×1550mm
Sink size
645mm×750mm×155mm
Effective scanning range
400mm×320mm×120mm
Maximum scanning speed
1200㎜/s
Recommended image resolution
1~4000μm
Emission and reception bandwidth
5~500MHz
DAQ
Sampling frequency 1GHz/s
Water-wastewater system
Water pump injection and drainage
Loading mode
Manual, semi-automatic, automatic(online)
